At the recently concluded Mobile World Congress (MWC) in Barcelona, a plethora of new devices, technologies, and services were unveiled. Samsung introduced its groundbreaking Galaxy Ring, prompting Honor to announce its entry into the smart ring and flip phone markets. Nubia is also gearing up to launch budget-friendly gaming, flip, and camera phones globally. Amidst all these exciting releases, the focus also turned towards the chipsets that power these devices.
Qualcomm, a renowned chipset manufacturer, has officially announced that the much-anticipated Snapdragon 8 Gen 4 will be launched in October 2024. This news was confirmed by Qualcomm’s Chief Marketing Officer (CMO), Don McGuire, in a video shared on X (via Android Headlines).
The annual Snapdragon Summit is scheduled for October where the Snapdragon 8 Gen 4 will take center stage. It is customary for Qualcomm to unveil its flagship SoC during this summit, so this announcement comes as no surprise.
McGuire also revealed that Qualcomm’s mobile platforms will undergo a transformation with the introduction of Oryon CPU. The upcoming Snapdragon 8 Gen 4 is expected to feature Oryon cores, which are custom-designed CPU cores by Qualcomm.
In addition to the new Oryon cores, the Snapdragon 8 Gen 4 will see a significant enhancement to its Neural Processing Unit (NPU). Reports suggest that this latest chipset will not include low-power efficiency cores but instead feature two high-performance “Phoenix” CPU cores and six medium-performance “Phoenix” CPU cores.
Leaks have hinted at the possibility of achieving speeds of up to 4GHz with the Snapdragon 8 Gen 4. While it’s unclear which core will reach this speed milestone, it is likely to be one of the two high-performance Phoenix cores.
The highly anticipated Snapdragon 8 Gen 4 is expected to power next-generation flagship smartphones like the Samsung Galaxy S25 series and possibly even the Xiaomi 15 Pro. Stay tuned for more updates on this flagship chipset as additional details are set to emerge in the coming months.
