Apple is making some big changes to the upcoming iPhone 16 models, with a focus on reducing the bezel sizes. According to The Elec via AppleInsider, Apple is requesting its panel suppliers to use BRS technology to make the bottom bezel of the iPhone 16 models thinner. However, this request is posing a challenge for suppliers as it requires them to hide circuitry under the bezel while ensuring proper heat dissipation.

Here’s what you need to know about Apple’s latest developments:

– Suppliers are facing difficulties in manufacturing displays with acceptable yields due to the complexities of shrinking the bottom bezel.
– LG Display, a key player in this supply chain, is turning to multiple sources for Display Driver IC (DDI) chips needed for the iPhone 16 line. This move aims to cut costs and create competition between suppliers, ultimately benefiting consumers.
– LG Display expects a significant increase in revenue from its iPhone business as it gains more orders from Apple. Last year, LG Display provided 52.5 million OLED displays for iPhones.
– Despite LG Display’s growing presence, Samsung Display remains the top supplier for iPhone panels, delivering close to 150 million OLED panels last year. China’s BOE, another supplier for Apple, sources DDI chips from LX Semicon.

These developments highlight Apple’s commitment to innovation and efficiency in its supply chain management. Stay tuned for more updates on the iPhone 16 series and how these changes will impact future models.