Our team at Phones Canada has learned that testing for the Pixel 9 series will begin in the middle of 2024. It has been reported that the 2024 Pixel 9 series will use the Tensor G4 AP, which will be very similar to the G3 currently powering the Pixel 8 series. However, this will mark the end of the Exynos-based Tensor chips, as the upcoming Tensor G5 is expected to be manufactured by TSMC using the latter’s 3nm process node. The chip will be fully customized by Google, allowing the addition of new, exclusive features made specifically for Pixel phones.

By utilizing TSMC’s 3nm node, Google aims to create a more powerful and energy-efficient Tensor chip with the codename “Laguna”. TSMC also plans on using advanced packaging technology, similar to the one used by Apple, to enhance energy efficiency. This could potentially improve the battery life of Pixel phones, which would be a welcome feature for Pixel users.

A former Google chip executive previously expressed uncertainty about whether Google would invest in the development of custom chipsets, especially considering the modest sales of the Pixel line. However, despite recent layoffs at the company, Google seems committed to the idea of breaking from Exynos and customizing the Tensor chipsets to elevate the Pixel line.

For Pixel buyers who share this sentiment, it might be wise to hold off on the Pixel 9 series expected this October, and instead, anticipate the potential introduction of the Tensor G5 in the Pixel 10. This could reveal Google’s full response to Samsung’s Galaxy AI attack with its own set of compelling features.