MediaTek recently released the Dimensity 9300 application processor (AP) without a cluster of low-powered Efficiency cores, opting instead for four Prime Cortex-A4 CPU cores and four Cortex-A720 Performance CPU cores. Initial rumors suggested the SoC might suffer from overheating, though MediaTek strongly denied these claims.

A more recent stress test led to a 46% throttling of the Dimensity 9300, prompting MediaTek to defend its design once again, calling the test “flawed.” However, according to a recent Weibo post by Digital Chat Station, the upcoming Dimensity 9400 will not feature four Cortex-X5 CPU cores and will instead include a total of eight CPU cores with a configuration of three Prime Cortex-X5 cores and five Cortex Performance CPU cores.

Additionally, rumors suggest that the Dimensity 9400 and Qualcomm’s Snapdragon 8 Gen 4 will both be manufactured using TSMC’s 3nm process node. However, due to Qualcomm’s new custom Oryon cores replacing Arm’s Cortex cores, the MediaTek chip is expected to have a big price gap compared to the Qualcomm AP. This could potentially attract Chinese phone manufacturers who may have typically opted for Qualcomm’s chipset.

While MediaTek’s Dimensity 9300 was announced last month, we still have a long way to go before the release of the Dimensity 9400.