In October 2021, Intel CEO Pat Gelsinger announced Intel’s plan to reclaim process leadership from TSMC and Samsung Foundry by 2025. This move marks Intel’s challenge to become a major player in the contract foundry segment of the industry, where companies like TSMC and Samsung Foundry currently dominate.

Here are some key points to consider:

– A contract foundry takes chip designs from fabless chip designers (like Apple) and manufactures the chips.
– TSMC and Samsung Foundry are currently shipping 3nm chips, with plans to mass-produce 2nm chips in the near future.
– Intel will be using its 20A process this year, equivalent to 2nm for TSMC and Samsung Foundry, for building its Arrow Lake PC chips.
– Intel is set to debut its 18A process node next year, equivalent to 1.8nm compared to TSMC and Samsung Foundry’s upcoming 2nm node.
– By 2027, Intel’s process nodes will reach 14A (1.4nm), aligning with TSMC and Samsung Foundry in terms of transistor size.

Intel’s strategic focus on technological advancements is evident in its pioneering features like PowerVia (backside power delivery). This innovation enhances chip performance by increasing clock speeds by up to 6% while improving overall efficiency.

Additionally, Intel is set to receive the first High-NA Extreme Ultraviolet Lithography machine, showcasing its commitment to cutting-edge technology. This new machine offers higher resolution patterns on wafers, allowing for more efficient chip production compared to older EUV machines.

Intel’s dedication to innovation is further highlighted by recent partnerships with Arm and Microsoft for custom chip designs using the advanced 18A process node. With a strong lineup of clients already onboarded for chip production using this technology, Intel is poised to lead the industry in performance and efficiency.

Stay tuned as Intel continues its journey towards reestablishing itself as a frontrunner in semiconductor manufacturing!