The latest news from Taiwan reveals that Google’s Tensor G5 application processor (AP) has officially taped out at the TSMC foundry. This means that the design phase is complete, and the chip is now ready for fabrication. Here are some key points to keep in mind about this exciting development:

– The Tensor G5 SoC is set to debut in next year’s Pixel 10 series, promising cutting-edge performance and exclusive features tailored for Pixel fans.
– Built using TSMC’s advanced second-gen 3nm node (N3E), this chipset represents a significant upgrade from the modified Exynos 2100 SoC used in the Pixel 6 lineup.
– Google has taken a hands-on approach to designing the Tensor G5, aiming to rival top chipsets from industry giants like Qualcomm, MediaTek, Samsung, and Apple.
– By taping out the Tensor G5 early, Google can thoroughly test and refine the chip to ensure optimal performance and avoid any potential issues before its official launch.

Looking ahead, the Pixel 9 will feature the Tensor G4 with an impressive configuration of eight cores, including high-performance Cortex-X4 CPU core and efficiency-focused Cortex-A720 and Cortex-A520 CPU cores. This chip will be manufactured by Samsung Foundry using its advanced 4nm process node.

Overall, Google’s commitment to developing cutting-edge processors like the Tensor G5 demonstrates its dedication to delivering exceptional performance and user experience in its upcoming devices. Stay tuned for more updates on the exciting developments in Google’s chipset technology!