Samsung is gearing up for the launch of its next foldable phones, the Galaxy Z Flip 6 and the Fold 6. With numerous leaks circulating, it seems like Samsung may not have many surprises left for us when they unveil these devices in July.

The latest leak provides more details on the Z Flip 6, giving us a closer look at what to expect from this foldable phone. The phone’s chipset results have surfaced on Geekbench, revealing some exciting features that users can look forward to:

– The Z Flip 6 will come equipped with the Snapdragon 8 Gen 3 chip, featuring a powerful Cortex-X4 core clocked at 3.4 GHz for enhanced performance.
– The phone will run on Android 14 out of the box.
– Model number SM-F741B is expected to be the European and North American variant, offering a generous 12GB of RAM for improved multitasking capabilities.

Geekbench scores for the Z Flip 6 are impressive, with single-core performance reaching 2,247 and multi-core performance hitting 6,857. These numbers represent a significant improvement over its predecessor, the Flip 5.

In terms of design and features, users can anticipate a similar 6.7-inch foldable screen, a 3.4-inch cover screen (rumored to be smaller than initially speculated), and an upgraded 50MP main camera for capturing stunning images.

While excitement builds for the unveiling of these devices on July 10, there is speculation about a potential price increase for the Z Flip 6. Reports suggest that it could be priced around $1,100 initially, with Samsung offering a “free” double storage upgrade to the 512GB variant as a promotional offer.

As we eagerly await further details on these upcoming foldable phones from Samsung, it’s essential to remember that not all leaked information may be accurate. Stay tuned for more updates as we approach the official launch date!