MediaTek, a leading supplier of application processors for smartphones, has been making waves with its flagship chipset, the Dimensity 9300. Despite not featuring a low-power efficiency CPU core, this SoC has proven itself by powering the Vivo X100 series effectively. In May, MediaTek upped the ante with the Dimensity 9300+, offering enhanced AI support and generating over $1 billion in revenue.

The company’s upcoming flagship chip, the Dimensity 9400, is highly anticipated. Expected to boast one Cortex-X5 prime CPU core, three Cortex-X4 CPU cores, and four Cortex-A720 efficiency-performance cores, it already has Vivo on board as its first customer. With Vivo already using the Dimensity 9300 SoC for its X100 series, expectations are high for the Dimensity 9400.

Another exciting development is MediaTek’s non-flagship Dimensity 8400 AP set to launch later this year. Leaked AnTuTu benchmark scores suggest that this chip outperforms Qualcomm’s flagship Snapdragon 8 Gen 3 SoC. The Dimensity 8400 could be a cost-effective option for phone manufacturers while maintaining impressive performance levels.

Xiaomi is rumored to be one of the manufacturers considering equipping their devices with the Dimensity 8400 SoC. Additionally, Xiaomi’s Redmi unit is said to be working on smartphones powered by chipsets like the Dimensity 9300+, Dimensity 8400, Snapdragon 8 Gen 3, and even the unannounced Snapdragon 8 Gen 4. These phones are expected to feature premium components such as metal frames, glass bodies, high-resolution displays, large batteries, and fast charging capabilities.

With its potential to offer more power than current flagship chipsets at a lower cost point, the MediaTek Dimensity 8400 could become a popular choice for mid-range handsets in the coming months. Manufacturers looking to deliver top-notch performance without breaking the bank will likely find this chipset appealing for their upcoming smartphone models.