Phones Canada is excited to share the latest news from TSMC, as reported by Nikkei Asia. The top contract foundry announced that it will begin producing chips using its 1.6nm process node starting in 2026. This cutting-edge technology was unveiled during the North America Technology Symposium held in California.

Here are some key points to keep in mind:

– TSMC’s upcoming application processors for smartphones will be built using the second-generation 3nm process node (N3E). This means that popular chips like the A18 Pro and A18 Bionic for the iPhone 16 series, Qualcomm’s Snapdragon 8 Gen 4 SoC, and MediaTek’s Dimensity 9400 chipset will benefit from this advanced technology.
– With smaller process node numbers come smaller transistors inside the chips, leading to improved performance and energy efficiency. TSMC’s upcoming 1.6nm node is expected to greatly enhance logic density and performance.
– CEO C.C. Wei highlighted TSMC’s commitment to offering customers cutting-edge technologies for AI applications using the world’s most advanced silicon.
– The 1.6nm node will introduce “backside power rails,” a feature that optimizes chip connectivity to power sources.

Looking ahead:

– In the second half of next year, TSMC plans to kick off mass production of chips utilizing its 2nm node, which will feature Gate-All-Around (GAA) transistors for improved performance.
– Industry experts are speculating about the future of transistor technology as smartphone processors continue to evolve towards greater power and efficiency.

Stay tuned for more updates as TSMC pushes the boundaries of semiconductor innovation!