The recently released Samsung Galaxy S23 FE has been creating a buzz in the tech world. One aspect that caught everyone’s attention is the improved performance of the Exynos 2200 chipset, especially when compared to its predecessor, the Galaxy S22 Ultra.
In a teardown video by PBKreviews, it was revealed that the enhanced performance of the Exynos 2200 in the Galaxy S23 FE can be attributed to its robust cooling system. The smartphone features a massive vapor chamber cooling system, which is noted as the largest ever seen on Samsung phones. This cooling system effectively regulates the device’s temperature, allowing for better performance with reduced throttling.
To dismantle the Galaxy S23 FE, one needs to remove 20 Philips screws initially. Afterward, the back plate can be easily taken off. In the process, ribbon connectors, a charging coil, and an NFC antenna need to be detached. The battery can then be safely removed using the pull tab. The main board houses all the essential components, such as the chipset, RAM, storage, sensors, and cameras.
Additionally, the Galaxy S23 FE has also received a commendable repairability score of 8.5/10. This suggests that repairing the device is relatively straightforward, making it a user-friendly option for those who may need to fix their smartphones in the future.
Overall, the Samsung Galaxy S23 FE stands out with its impressive performance, thanks to the enhanced Exynos 2200 chipset and the remarkable vapor chamber cooling system. With its user-friendly repairability and sleek design, the Galaxy S23 FE has captivated tech enthusiasts and consumers alike.