Your Trusted Mobile Devices Partner

Menu

Search
Close this search box.

Search

Samsung Unveils Groundbreaking 36GB DRAM Chip: Paving the Way for AI 6G Technology in Telecommunications

Get ready, because 6G is on the horizon, and it’s set to be driven by artificial intelligence (AI)! The evolution of mobile networks began with 2G in 1991, followed by 3G in 2001, 4G in 2009, and the recent introduction of 5G in 2018. While the official release date for 6G has not been confirmed yet, experts predict that it will revolutionize the telecommunications industry sooner than we think.

What can we expect from the sixth-generation (6G) mobile networks? Well, according to experts like Qin Fei from vivo, it will bring about a new era of intelligent or smart internet of things. With advancements in data latency, security, reliability, and the ability to handle vast amounts of data instantaneously on a global scale, 6G is set to transform both leisure and work activities. Vivo envisions groundbreaking applications such as mixed reality experiences, holographic communication, interactive digital humans, cooperative robots, and autonomous driving.

Samsung is also jumping on the AI-driven 6G bandwagon alongside other industry leaders. The tech giant recently announced its participation in the AI-RAN (Artificial Intelligence-Radio Access Network) Alliance at the Mobile World Congress (MWC) in Barcelona. This alliance aims to promote innovation in 6G technology by combining AI with wireless communication technology. Samsung is joined by companies like Arm, Ericsson, Microsoft, Nokia, NVIDIA, SoftBank and Northeastern University as founding members of this alliance.

In addition to AI-driven advancements in telecommunications technology for 6G networks, Samsung has introduced a groundbreaking development – the industry’s first 12-stack HBM3E DRAM chip with a capacity of up to an impressive 36GB. This high-bandwidth memory solution is designed to meet the increasing demands of AI service providers for higher-capacity memory solutions. Yongcheol Bae from Samsung Electronics highlights that this innovation underscores Samsung’s commitment to developing core technologies for high-stack HBM and leading the high-capacity memory market in the AI era.

With these exciting developments on the horizon for telecommunications and mobile technology enthusiasts worldwide can look forward to a future where AI-driven innovations will shape how we interact with technology on a whole new level!

Share on:

Leave a Reply

Follow Us

Featured Post
Get The Latest Updates

Subscribe To Our Weekly Newsletter

No spam, notifications only about new products, updates.
On Key

Related Posts