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Tech Giant Poised to Lead Telecommunications Process, Surpassing TSMC and Samsung Foundry

Intel’s New Chip-Making Venture Set to Surpass TSMC and Samsung Foundry

Intel, the U.S. chip-making giant, recently announced that it will take over process leadership from TSMC and Samsung Foundry next year. This comes after signing Microsoft as its first customer for chips made using its Intel 18A process.

Key Points:

– Intel’s 18A process will outperform TSMC and Samsung Foundry’s 1.8nm node.
– As chips get smaller, they become more powerful and energy-efficient.
– In 2023, the A17 Pro chip contained a whopping 19 billion transistors, up from the A13 Bionic chipset’s 8.5 billion in 2019.
– By 2026, Intel is expected to start producing chips using its Intel 14A process.

Intel has already secured four “large” customers for its Intel 18A production, with Microsoft being one of them. Additionally, GPU and AI chip designer Nvidia is reportedly considering a deal with Intel.

Intel’s expansion into chip-building for other companies reflects the success of firms like TSMC and Samsung Foundry in catering to fabless chip designers. The company aims not only to take over process leadership but also to improve AI chips’ performance.

Microsoft Chairman and CEO Satya Nadella explains why they chose to have their new chip built by Intel: “We need a reliable supply of the most advanced, high-performance and high-quality semiconductors.”

Stay tuned as Intel continues to make waves in the chip-making industry!

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