We have some exciting news for all Apple fans out there! A recent report, supposedly from an Apple employee on LinkedIn, suggests that Apple is diving into the world of chip design with TSMC’s cutting-edge 2nm process node. Here’s what we know so far:
– Leaked slides from a Korean website and shared on Twitter hint at Apple’s plans for future chips.
– As the chip size decreases with each new process node, more transistors can fit inside, making the chip more powerful and energy-efficient.
– Currently, only the iPhone 15 Pro and iPhone 15 Pro Max boast a 3nm chip.
Looking ahead:
– The upcoming iPhone 16 lineup is expected to feature 3nm chips across all models.
– TSMC is gearing up to start producing 2nm chips by late 2025, with even smaller 1.4nm chips in the pipeline for 2027.
What sets TSMC’s new node apart:
– The transition to Gate-all-around (GAA) transistors from FinFET transistors will enhance performance.
– GAA transistors surround the channel on all sides, reducing current leak and boosting drive current for improved chip performance.
It’s no surprise that Apple is at the forefront of adopting these cutting-edge technologies. Stay tuned for more updates as we witness the evolution of Apple’s chip designs!
